Wednesday, November 19, 2003
Amkor Technology has introduced a new packaging technology for game, memory, and I/O cards, which is less expensive than traditional methodologies.
Using a new proprietary manufacturing processes, including leadframe-based fully transfer molded production, Amkor's so-called AmKard packaging solutions present memory card suppliers with significant cost savings over traditional lidded memory card assembly.
A reduction in the cost of retooling for each individual custom lid reduces cycle time by two to three days. Compared to conventional size restricted methods of assembling standard-format memory cards, AmKard molding technology enables more available package real estate and more efficient substrate layout, including the ability to stack die or fit more or larger die in the same space.
By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved
|
