Wednesday, December 3, 2003
Toshiba Corp. and SanDisk Corp. to move up construction of their 300-mm wafer fab a year ahead of schedule to meet the increasing demand, the company said.
Building a new 300-mm wafer fab by 2006 in Toshiba's Yokkaichi plant with the total investment of 200 billion yen (about $1.9 billion) was planned in late 2002. But expecting flash memory market to double from 2003 to 2006, Toshiba and Sandisk moved up their new fab plan to begin operation late next year with initial capacity of 10,000 wafers a month.
Flash Vision, the joint venture by the two companies, will operate the new 300-mm wafer fab with 70-nm process. Both companies will introduce 90-nm process products in Q1 2004.
By: DocMemory
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