Wednesday, December 31, 2003
Taiwanese chip maker Winbond Electronics Corp. will finalize its plans to build a 300-mm fab next month.
Possible partners for the $2.2 billion plant include Germany's Infineon Technologies AG and Japan's Sharp Corp., according to the report, which cited the Economic Daily News.
"The plan hasn't really been decided yet. We will finalize it before the Chinese Lunar New Year and will hold a meeting at that time," said Wilson Wen, vice president of Winbond, in the report.
In 2004, the Chinese Lunar New Year falls on Jan. 22. Winbond is a supplier of DRAMs and other chip products.
By: DocMemory
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