VIA Technologies selects IBM to manufacture its upcoming Esther processors. The chips will be made using 12-inch, 90nm SOI CMOS, low-k dielectric manufacturing technologies at IBM's East Fishkill, New York fab.

Taiwan Semiconductor Manufacturing Company (TSMC) will continue to produce VIA’s existing processor lines and core logic chipsets, advanced communications, networking and multimedia chip solutions, VIA said.

VIA expects to launch the Esther processors in the second half of this year.

By: DocMemory
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