Winbond Electronics said it will completely drop the production of commodity DRAM by the third quarter of 2004 except for shipments it has committed to make to Infineon Technologies.

Winbond said its pricing model with Infineon and its focus on non-commodity DRAM will reduce the impact on its operation from the traditionally volatile DRAM pricing.

Winbond expects to break ground on its 12-inch fab in the third quarter in the Taichung Science-Based Industrial Park in central Taiwan, according to the press release.

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved