Smart Modular Technologies have developed a range of lead-free DDR modules, designed to meet emerging global
requirements resulting from the banning of lead from electronics products

As a result of recent European legislation, the Restriction of Hazardous Substances (RoHS), most new electronics products containing lead will be banned from sale in Europe starting in 2006. Countries such as China, Japan and the United States are considering similar laws.

The company has implemented a lead-free manufacturing and material assessment process to ensure that designated DDR modules conform to lead-free requirements, using a standard lead-free alloy standard, which is made of tin, silver and copper.

The lead-free modules consist of memory devices, printed circuit boards (PCBs), capacitors, resistors and other materials that conform to legislative guidelines governing lead- free status. Currently, components, including PCBs, are considered lead-free compliant if their lead content is less than 0.1 wt% , 1000 ppm and meet other temperature and reliability requirements. Whereas JEDEC requires suppliers to provide testing data at 245C for large components and 250C for small components, Smart requires suppliers to provide testing data at 260C for all its components. The company also requires compliance with additional reliability testing and tin whisker testing for tin-based component coatings.

"Current environmental regulations, such as RoHS, require the elimination of other trace elements such as hexavalent chromium, cadmium and cadmium compounds, mercury and mercury compounds, poly-brominate biphenyl (PBB) and poly-brominate diphenyl ethers (PBDE) in addition to lead,”” said Arthur Sainio, Smart´s senior product marketing manager. "Smart is developing solutions to meet such new restrictions to help customers prepare ahead of the 2006 deadline."

By: DocMemory
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