Friday, February 27, 2004
Fujitsu sets aside a budget of $1.5 billion to build a 300mm fab that will produce 10,000 wafers a month scheduled to start production in spring 2005, reported a Japanese newspaper.
Other major semiconductor makers in Japan have already have plans to build 300mm fabs. Toshiba for one, has just completed its first 300mm fab in Oita. NEC Electronics is building a fab in Yamagata will production begin this year.
Elpida Memory Inc. is increasing the DRAM capacity of its 300mm fab in Hiroshima toward 15,000 wafers a month. Renesas Technology, a joint venture of Hitachi and Mitsubishi Electric, took over a 300mm fab and is now expanding the capacity. Sony is also building a 300mm fab in Nagasaki.
By: DocMemory
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