Thursday, March 4, 2004
Fujitsu Ltd is planning to spend $1.5 billion to build a 300mm fab, which will begin operation in spring 2005 with a capacity of 10,000 wafers a month, reported a Japanese newspaper.
Fujitsu acknowledged that they are considering a new fab, but said nothing has been nailed down yet. "No final decisions have been made with respect to details, such as location and scale," the company said in a statement. "We will make a formal announcement after such decisions are made."
Among the major players in Japan's semiconductor industry, only Fujitsu has not disclosed a plan to shift to 300mm wafer production. The company's electronic device business had been in the red since 2001, turning profitable again in the second and third quarters of 2003 because of resurgent demand in the consumer electronics and IT sectors.
To maintain competitiveness and scale of economy, Fujitsu needs to be more aggressive with its fab plans, analysts said.
By: DocMemory
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