Tuesday, March 9, 2004
Taiwan Semiconductor Manufacturing Co. (TSMC), the world's biggest made-to-order chipmaker, is planning to build one more 12-inch silicon-wafer fabrication plant and a 35nm-process technology development center.
Vice CEO F.C. Tseng said recently that his company was indeed seeking sites for the construction of the planned leading-edge facility, which would come with a 35nm-process technology development center. In addition to the Central Taiwan Science Park. A local newspaper reported that TSMC could spend NT$300 billion on its third 12-inch wafer fab to require a100 hectares of land and a research center in the Central Taiwan Science Park in Taichung. TSMC's spokeman, Tzeng Jin Hao said: "Taichung is one of our options, but we haven't come to a final decision yet."
"The capacity expansion aims to meet future demand." TSMC executives preliminarily regarded the Central Taiwan Science Park as an ideal location for the company's new 12-inch fab based on the consideration that it is as far from the Hsinchu Science-based Industrial Park (HSIP) as it is from the Southern Taiwan Science Park (STSP). TSMC owns one12-inch wafer in Hsinchu and the other one in Tainan with total production could reach 10,000 chips each per month.
Beside TSMC, Winbond Electronics Corp. and ProMos Technology Inc. are also planning to construct similar facilities at the central Taiwan Park.
By: DocMemory
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