Friday, March 19, 2004
Fujitsu plans to spend about US$1.5 billion to add a 300-mm wafer fab to its Mie semiconductor complex in central Japan, the company said.
The facility will ramp up making logic circuits using 90-nanometer manufacturing processes on 300-mm diameter wafers, before adding next generation 65-nm technology, Fujitsu said.
Operations will start in April 2005 and volume shipments begin from September 2005. Total production after the complete investement will have the capacity of 13,000 wafers per month.
By: DocMemory
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