Monday, April 5, 2004
Winbond Electronics Corp. and Etron Technology Inc. recently received huge orders from Intel Corp. and Sharp Corp. for their memory chips, which will be bundled with multi-chip package (MCP) products installed in next-generation handsets.
Both companies are expected to boost and start shipming 1T static random access memory (SRAM) and synchronous dynamic random access memory (SDRAM) chips next quarter. Intel and Sharp recently turned to Winbond and Etron for 1T SRAM and SDRAM chips because of supply shortage worldwide incurred by excessive handset demands.
Winbond executives pointed out that their company has received sizable orders from the world's top four MCP-device suppliers since it was transformed into a niche-memory supplier from a staple-memory supplier in 2002. The company expected its 1T SRAM shipment to rise to 15,000 eight-inch wafers of chips throughout this quarter from last quarter's 10,000 wafers.
It projected second-quarter shipment to post at 20,000 wafers of chips. Etron has contracted Powerchip Semiconductor Co. (PSC) and Semiconductor Manufacturing International Co. (SMIC) to build its 1T SRAM, lower-voltage SRAM, double data rate (DDR) graphics chips and SDRAMs for DVD players. PSC will make Etron's Intel chips with 0.13-micron process at its 12-inch wafer fab. PSC's top executives pointed out their company will set aside 10% of its 12-inch fab capacity for production of Etron's chips to boost the customer's competitiveness.
By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved
|
