Monday, June 14, 2004
TSMC has been shipping parts to customers based on the 90-nm technology for some time. But it is expected to move into "full production" by the fourth quarter of 2004, said Chuck Byers, director of brand management at TSMC.
For some time, TSMC has been in what the company calls "risk production" at the 90-nm node. In 2002, TSMC outlined and disclosed accelerated targets for next-generation ICs fabricated with 90-nm process technology. At the time, the world's largest silicon foundry said it would move into "risk production", or early production, in the third quarter of 2002.
Full production is defined "by the number of products in volume production with acceptable yields," Byers said. "Anything below that is risk production."
TSMC is shipping its 90-nm process on 300-mm wafers, equipped with low-k technology. The company's rivals, including UMC, are offering both low-k and FSG at the 90-nm node.
TSMC is also engaging with customers with its 65-nm process technology, with products expected to be shipped in the first half of next year, or earlier. Volumes for 65-nm products are not expected until 2006.
By: DocMemory
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