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Infineon and NanYa JV setups up 300mm Fab


Tuesday, July 13, 2004 Inotera Memories Inc, a joint venture of Infineon Technologies AG and Nanya Technology Corp, announced the inauguration of its 300mm semiconductor production facility in Taoyuan, Taiwan.

Inotera will produce memory products at the 300mm DRAM production site with a total capacity of more than 50,000 wafer starts per month when fully operational. The first DRAM chips using 110nm trench technology are rolling off the new production site located at HwaYa Technology Park, Taiwan. Inotera's production volume of memory products will contribute to Infineon Technologies and Nanya Technology Corp and help each partner to expand its position in the DRAM market.

"We are very proud of having finished construction and started the ramp up within a record time of only 18 months," noted Charles Kau, president of Inotera Memories. "Inotera combines Nanya's expertise in mass production and efficient cost reduction capability with Infineon's technology in 300mm production. We are dedicated to the continuous development of manufacturing technologies and processes, and are committed to the manufacturing of high quality products at low cost with a high degree of flexibility."

The cooperation on standard memory chips between Infineon and Nanya started in November 2002. Besides the set up of the 50:50 joint venture Inotera Memories, both companies are jointly developing 90nm and 70nm trench technologies.

The 300mm semiconductor facility will be equipped in two stages aligned with the growth and development of the world semiconductor market. The first stage has been completed according to schedule and the ramp up of DRAM products has already started in April 2004.

By the end of 2004, more than 20,000 wafer starts per month are planned. The initial production of memory products at Inotera is based on the 110nm process technology; the transition to 90nm is expected to start in 2005.

Completion of the second stage is currently anticipated by the end of 2005. The total capacity will then be increased to more than 50,000 wafer starts per month.

The total investment of the joint venture amounts to around US$2.2 billion. Currently the company deploys 1,100 employees. With the completion of the second stage the headcount is expected to increase by 500 employees to approximately 1,600.

By: DocMemory
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