Friday, July 23, 2004
The chairman of Power Chip Semiconductor , Dr. Frank Huang said that his company has start focusing on double data rate (DDR) III memory market as it is already contracted to make the chips for Elpida Memory of Japan.
Intel has sought DRAM (dynamic random access memory) makers Elpida, Samsung Electronics and Micron Technology to co-develop DDRIII format and related products. Intel is promoting 800MHz and 1.2GHz as the two major two formats of DDRIII, which are one to two times faster than DDR 400MHz.
The DDRIII formats will be available in 2006. However, there were reports that DDR 2 will be slowdown due to the recent defect report on Intel's chips. In related news, Powertech Technology has announced to begin packaging 512Mbit DDR2 for Elpida Memory in September, using micro-BGA (ball-grid array) technology from Hitachi Cable.
Powertech starts testing 200,000-300,000 DDR2 chips for Elipda this month and by September, the packaging will reach 2.0 million chips per month. Local DRAM packaging and testing firms need to invest in new testers and packaging technology to prepare for when DDR2 becomes the mainstream DRAM sometime next year. According to DRAMeXchange, DDR2 will only account for 15% of the worldwide DRAM output by the end of this year, compared to 77.7% for DDR. DRAMeXchange estimates DDR2 packaging and testing services are 20-30% more expensive than those for DDR.
By: DocMemory
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