Tuesday, September 7, 2004
Samsung Electronics Co., Ltd., the world's largest memory chipmaker, has released a 2.5-Gbit multi-chip package (MCP) memory for third-generation mobile phones, the company said Monday (Sept. 6).
The component includes two 1-Gbit NAND flash memories for data storage and two 256-Mbit DRAMs that serve as a temporary buffer, for a total of four dies stacked in a single chip package. The new device operates from a 1.8-volt power supply and supports the transmission of four hours of quarter video graphics array (QVGA) quality video.
Samsung has been particularly active in developing multi-chip package components.
By: DocMemory
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