Thursday, October 28, 2004
Micron Technology is making both specialized DRAMs and flash memory components to go into mobile phones, but it does not intend to make the multi-chip packages (MCPs) that have become a significant part of the market now..
But as Micron builds its volume of NAND flash production, a memory type that the mobile phone market is turning towards, there may be temptations to try and be like Samsung Electronic and make, or have made, the multi-chip package memories for handset builders, as well as the die within them.
"At the moment we're not manufacturing MCPs. We don't want to compete with our customers," said Jan du Preez, vice president of the networking and communications group at Micron.
Micron' customers are the flash memory makers who have grabbed the MCP high ground and supply the likes of Nokia, Sony-Ericsson, Motorola, Siemens, even though they do not make DRAM — flash memory making companies such as Toshiba, Spansion, STMicroelectronics, Intel.
For, despite a lack of standardization, MCPs have become big business and supplying packaged multi-chip components is one rung further up the food chain from supplying known good die or tested wafers. Du Preez estimates that one third of memory sold into mobile phone handsets comes in the form of MCPs and this has happened since first arriving in the mobile phone market three years ago.
By: DocMemoru
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