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Atmel produces mixed memory MCP components


Wednesday, November 17, 2004
Atmel said it has a developed a family of stacked flash and pseudostatic random access memory (PSRAM) components ranging in size from a 16-Mbit flash with an 8-Mbit PSRAM up to a 128-Mbit flash memory with a 32-Mbit or 64-Mbit.

The multi-chip packages are offered in both 2.7-V and 1.8-V ranges, with a read access time of 70-nanoseconds, and are intended for use in mobile phones and PDAs, Atmel said.

Atmel indicated that the flash memory die were its own but did not say whether it was getting the PSRAM die made externally.

The modules are offered in a 67-ball CBGA and an 88-ball CBGA package. The package size is 8-mm by x 10-mm.

The multi-chip packages are offered in both 2.7-V and 1.8-V ranges, with a read access time of 70-nanoseconds, and are intended for use in mobile phones and PDAs, Atmel said.

Atmel indicated that the flash memory die were its own but did not say whether it was getting the PSRAM die made externally.

The modules are offered in a 67-ball CBGA and an 88-ball CBGA package. The package size is 8-mm by x 10-mm.

By: DocMemory
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