Integrated Device Technology, Inc (IDT) announced that it is sampling its new advanced memory buffer (AMB) device to multiple fully buffered dual-inline memory module (FB-DIMM) manufacturers.

The new product is fully compliant with the JEDEC AMB specifications and is an essential building block for next-generation, high-bandwidth applications such as servers and workstations, which require increased performance and large memory capacities.

A key attribute of the FB-DIMM channel architecture is the high-speed, serial, point-to-point connection between the memory controller and modules on the channel. The AMB chip located on each FB-DIMM collects and distributes the data from or to a DIMM, buffers the data internally on the chip and receives or forwards it to the next DIMM or memory controller. This unique channel structure alleviates buffer latency issues common in registered DIMM technology, and enabling designers to use a large number of DIMMs within a single system.

Tom Kao, director or marketing for the IDT DIMM support products group, said "The introduction of our AMB device serves as a proof-point of our desire to address the new advancements in server processing power brought on by the emerging FB-DIMM standard. We are pleased to be on the leading edge of companies delivering AMB product samples to market and look forward to helping our customers address the critical ongoing challenges associated with the DIMM market."

The IDT AMB product is sampling, with production quantities available during the first half of 2005.

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved