Friday, January 14, 2005
Hynix Semiconductor Inc. has signed a deal with ProMOS Technologies Inc. for using its equipment to produce chips on 300-millimeter wafers, according to a news source.
The deal allows Hynix to move up to manufacturing on 300-mm diameter wafers without any additional investment, the source quoted Hyix as saying.
In exchange for letting Hynix using its equipment, ProMOS would license Hynix's stacked capacitor DRAM technology, the srouce said. Undel the deal, ProMOS is to supply chip foundry equipment for Hynix to process wafers at it plant in Ichon, south of Seoul.
By: DocMemory
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