Tuesday, January 25, 2005
Samsung Electronics has developed an eight-die multi-chip package (MCP) technology, is being targeted for use in high-capacity mobile devices such as 3G handsets and other tightly integrated mobile devices.
The company claims the eight die MCP will be the first to be deployed in a commercial product.
Samsung says that using its Wafer Supporting System technology to make wafers thinner during design processing, it has managed to minimize overall die thickness as well as decrease the space between the stacked dies. "As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2 gigabits in a package that is 1.4mm thick, equalling the thickness of a four-die MCP solution," the company said in a statement.
Typically, as the number of chips per memory package increases, so does the thickness of the package.
The eight-die MCP uses all the memory devices available today for mobile products in a single 11 x 14 x 1.4mm package. It includes two 1Gbit NAND flash memories, two 256Mbit NOR flash memories, two 256Mbit mobile DRAMs, one 128Mbit UtRAM and one 64Mbit UtRAM.
By: DocMemory
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