Thursday, February 3, 2005
Winbond Electronics Corp. has recently received NT$8 billion syndicated loan from 23 banks to build 12-inch foundry in Taichung, central Taiwan. The top lending banks are Bank of Taiwan, First Commercial Bank, Chinatrust Commercial Bank and Taishin International Bank are the main arrangers of the five-year loan among the 23 listed banks for five years period.
Winbond expects to produce DRAM for Infineon Technologies using 0.11-micron trench technology when the fab first starts production, said Arthur Chiao, chairman of Winbond. Chiao added that Winbond's yield rate for the process at its current 8-inch fab is similar to that of Nanya Technology, which also licenses Infineon's technology.
In the long term, Winbond's 12-inch fab is expected to produce single-transistor pseudo-SRAM (1T PSRAM), using Infineon’s 90nm technology, as well as other specialty memory chips. Chiao said the fab may also produce flash-memory chips, but at this stage the firm does not have a timeline for moving into flash production.
Presently, Winbond allocated 70% of its total capacity to producing memory chips, with the remaining allocation for logic ICs. Handset-use memory ICs and commodity DRAM accounted for 90% and 10% of the firm's memory production, respectively. Also, Winbond reported a profit of NT$3.3 billion for the first nine months of last year, compared with loss of NT$1.3 billion in the same period of 2003.
By: DocMemory
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