Tuesday, February 22, 2005
Samsung Electronics said it has mass production the world's largest-capacity multi-chip package (MCP) memory at 2.5-Gbit capacity for multimedia-intensive mobile phones.
The component would allow mobile phones to catch up with personal computers in terms of main memory by holding as much as 320-Mbytes of memory.
Samsung's 2.5-Gbit MCP consists of four die, a stack of two 1-Gbit NAND flash memory chips and two 256-Mbit DRAMs optimized for low-power consumption. The MCP operates from a 1.8-V power supply and is capable of storing up to four hours of video data at QVGA resolution.
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