Wednesday, March 9, 2005
Elpida Memory Inc. has made an additional investment of 100 billion yen (about $960 million) on a second 300 mm wafer fab under construction.
Elpida first announced it would build the second fab last June with a capacity of 60,000 300-mm wafers a month when fully operational. The fab is scheduled to open in December and ramp up to an initial capacity of 15,000 wafers a month the first quarter of 2006.
Total investment in the fab is expected to top off around $4 billion.
The line will use 90nm process technology initially but is capable of fabricating DRAMs using 80nm technology, according to Elpida.
Elpida's first 300 mm wafer fab, also in Hiroshima, now produces 30,000 wafers a month. Currently it uses 110nm and 100 nm processes, but will migrate to 90nm processes shortly, said an Elpida spokeswoman.
By: DocMemory
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