Targeting advanced flip-chip applications, Singapore-based STATS ChipPAC Ltd. said today it would offer 300mm wafer bumping service to Taiwan Semiconductor Manufacturing Co. customers in Q3.

Using consigned equipment, the electroplating bumping technique is aimed at fine-pitch flip-chip applications requiring high bump quality and yield, finer bump pitches and higher temperature resistance.

“Flip chip is important for applications with intense performance demands and space constraints such as graphics, chipsets, digital signal processors, radio frequency, analog and power management,” Scott Jewler, chief strategy officer at STATS ChipPAC, said in a statement.

The company said its goal is to broaden its advanced flip chip services portfolio and offer volume manufacturing by Q3, with the services to be first available to TSMC customers.

“Electroplated wafer bumping provides significant advantages to our customers in terms of technology, performance and quality and was a critical piece of our strategic plan to offer a comprehensive turnkey service offering for advanced flip-chip applications in the second half of 2005,” added Han Byung Joon, CTO at STATS ChipPAC, in the statement.

Further, the company reported it has expanded the solder alloy choices for its current flip-chip offering and enriched its design, simulation and characterization capabilities for high-end flip-chip packages.

STATS ChipPAC has added ultra low alpha Hi Pb composition to its standard offering of eutectic and lead free (Pb free). The addition of Hi Pb alloy is particularly important to semiconductor companies with devices requiring high temperature stability, very high reliability, and resistance to electromigration. The assembly process for Hi Pb bumping was qualified in Q4 2004 and has achieved high volume manufacturing.

STATS ChipPAC currently offers flip-chip services such as 200mm wafer bumping, redistribution and repassivation, wafer sort, assembly and test. The company's flip-chip portfolio includes single die, multi-die, multi-package and thermally enhanced solutions.

By: DocMemory
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