Micron launched a family of mobile DDR devices that it claims offer an enhanced feature set that delivers aggressive power specifications, superior bandwidth performance, and increased reliability over standard DRAM.

The new mobile DDR is already available in 128Mb in x16 and 512mB in x16 and x32 configurations and 256Mb devices are scheduled for launch in the second half of this year. The new family adopts a new architecture with Micron's Endur-IC technology that is specifically designed for mobile systems. In addition to exceeding the JEDEC (Joint Electron Device Engineering Council) standard and offering unimpaired performance from -40 degrees up to +85 degrees Celsius, Micron claims improved stackability and customer confirmation that the new mobile DDR products offer the industry's lowest standby current.

"There are numerous features derived from Micron's new architecture that translate to system performance benefits for our customers, especially those customers requiring thin die specifications," said Deb Matus, Micron's product marketing manager for mobile memory. "Micron's Mobile DDR parts demonstrate great immunity to failures arising during manufacturing and packaging processes, making them the ideal device for die-based applications, multichip packages (MCPs), system-in-a-package (SiP), package on package (PoP) and other stacked solutions. Additionally, mobile phone manufacturers benefit from the extended battery life in standby mode provided by our Endur-IC technology."

In addition to the new mobile DDR product family, Micron also offers a growing family of Mobile SDR devices.

By: DocMemory
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