Friday, May 27, 2005
Hynix is expected to more than double its NAND flash wafer starts by year-end while Micron Technology will begin volume producing NAND flash on 12-inch wafers, according to sources.
Sources at Hynix pointed out that the company expects to increase its NAND flash wafer starts to 100,000-130,000 8-inch wafers by year-end, up from 50,000 now. As a result, its NAND flash capacity will account for 40% of its overall capacity by year-end, the sources indicated.
In addition, Micron will start volume producing NAND flash at its 12-inch wafer fab using 90nm technology next quarter and expects to see its NAND flash monthly production doubling from less than 500,000 chips per month now, sources said
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