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China to build 20 new fabs by 2008


Monday, June 13, 2005

SEMI said that 20 new fabs will be built in China between now and 2008, and many of them will be furnished with used equipment.

That's according to a new report on the Chinese process equipment and materials market outlook, published by the consortium.

According to SEMI's report, in 2004 new semiconductor equipment sales in mainland China reached $2.73 billion; used/refurbished equipment sales were an estimated at US$180 million; fab materials sales totaled $391 million; and the packaging materials market reached $781 million.

The report indicates that there are approximately 200 assembly and test companies; 20 multinational packaging materials suppliers; and 40 domestic manufacturers of equipment for the semiconductor and related microelectronic industries in China.

By: DocMemory
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