Friday, August 5, 2005
Local sources reportedly that world's largest foundry Taiwan Semiconductor Manufacturing Co. (TSMC), received Microsoft's XBox360 chipsets order. TSMC's to make north-bridge chips for its Xbox360 game consoles with 90-nm process, which some industry's experts said that Microsoft is largest customer of TSMC using the 90-nm process service next quarter with production volume of 6,000 300-mm wafers a month, increased by nearly 10% of TSMC's 300-mm wafer fab capacity.
Moreover, they said that it is possible that Microsoft will contract Advanced Semiconductor Engineering (ASE) Inc. to do packaging and tests on the chips built on Xbox360 machine. Microsoft's XBox360 is second generation of its game consoles that the company planning to launch before Sony's PS3 consoles. Microsoft designs its north-bridge chips around the patents licensed from graphics-chip vender ATI Technologies.
Meanwhile, TSMC said the company will withdraw from the Sematech consortium in so far as advanced research is concerned, but is still involved in discussions with regard to its overall participation. "I think the key point is, the real story is, that there are still discussions between TSMC and Sematech," said Chuck Byers, a spokesman for TSMC. For its part, Sematech spokesman Dan McGowan said TSMC's move wouldn't affect its employees or its research and manufacturing programs. " In our 18 year history, we've often dealt with members changing their status." TSMC will officially withdraw Aug. 22 as schedule.
By: DocMemory
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