Thursday, August 11, 2005
Taiwan-based testing houses will see a rebound in memory testing orders from Hynix Semiconductor starting this month, as the Korea-based memory maker is seeing a smooth transition to 90nm DRAM production, which is placing pressure on its own testing capacity, according to comments made by industry sources in Taiwan.
Hynix saw a significant ramp for its 90nm-made DRAM output from late July, thanks to a smooth migration to 90nm production at its 12-inch fab, the sources noted. In line with the ramping output, the total time needed to test the DRAM output has increased 40-60%, the sources added.
According to Taiwan-based equity firms, Hynix is not able to fulfill the required memory testing capacity using its own resources. Hynix owns 32-35 Advantest-made T5585 testers and 19 T5593 testers but it is still unable to meet testing demand for the ramping memory output, the equity firm indicated.
Powertech Technology (PTI), Thailin Semiconductor and United Test and Assembly Center (UTAC) Taiwan, the chief testing partners for Hynix, are all seeing increased orders this month and they expect orders to increase further in September, according to sources at the companies. As outsourcing continues increasing, the sources anticipate that by the fourth quarter, Hynix outsourcing levels should rebound to the same levels as the second quarter.
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