Micron (Boise, Idaho) claimed to be the first supplier to demonstrate 4-GB density FB-DIMMS. The company said its modules, which use 1-GB DDR2-533 components and are expected to begin appearing in production systems during the first half of 2006, allow server platforms to realize the maximum available capacities of system memory.

Meanwhile, Infineon (Munich, Germany) said it is currently sampling the industry's only double data rate 2 (DDR2) FB-DIMMS to incorporate key components all designed and manufactured by a single DRAM supplier. Infineon said the modules, available in densities ranging from 512 megabytes to 4 GBs, are based on an advanced memory buffer (AMB) chip, DDR2 DRAM chips and a proprietary heat sink all sourced from Infineon. The company said it offers the AMB logic chip to other FB-DIMM manufacturers and has already shipped samples to first customers.

"High-density FB-DIMMs are essential to increasing memory capacity and performance in volume server platforms beginning in 2006," said Jim Pappas, director of technology initiatives for Intel Corp.'s Server Platforms group, in a statement.

"FB-DIMM and DDR2-533/DDR2-667 are the key technology combinations for high-density, high-performance memory required in next-generation, bandwidth-intensive server applications," said Terrry Lee, executive director of advanced technology and strategic marketing for Micron's System Memory group.

"Optimal production of the new modules requires innovation in three areas: high-density and high-speed DDR2 DRAM, the AMB chip and heat sink to manage thermal load resulting from the combination of high memory density and the high-speed AMB chip," said Michael Buckermann, head of the computing business unit of Infineon's Memory Products group.

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved