Wednesday, September 14, 2005
Intel's average manufacturing cost per die will remain constant at approximately $40 during the period 2003 to 2005, despite increasing die sizes and rising cost of fabs, mask sets, according to In-Stat.
Intel Corp. continues to lead the semiconductor market in manufacturing process development and in fab capacity, In-Stat said. The chip giant currently has three 90-nm capable fabs, and will have four 65-nm fabs, including one retro fit and one 90-nm conversion, ramping in 2006, the market researcher said.
“As other semiconductor manufacturers turn towards partnerships for developing new process technologies and manufacturing capacity, Intel is one of the few vendors that can continue to push ahead alone and uses its technology and capacity as a competitive strength,” said Jim McGregor, In-Stat analyst, in a statement. “For example, in 2004, with a strong transition to the 90-nm process node and 300-mm wafers, Intel realized an estimated savings of $1 billion in manufacturing costs.”
With the transition to 65nm, Intel is planning to begin moving its entire product portfolio, including logic and memory, to a single process.
By: DocMemory
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