The proportion of 12-inch wafer output continues to rise globally and the related capacity should account for one-quarter of worldwide semiconductor capacity in 2005, according to George Burns, president of Strategy Marketing Associates. Burns added that Taiwan should lead the Asia-Pacific region this year in terms of 12-inch DRAM production capacity, outpacing South Korea.

Chipmakers invested a total of US$30 billion for 12-inch fab construction in 2004, Burns indicated. By end of 2005, there should be 48 12-inch fabs under construction globally, he noted. Capacity for 12-inch wafer production should reach about 950,000 wafers per month, with 350,000 of those wafers allotted to DRAM production.

Burns pointed out that Taiwan makers should account for 31% of worldwide 12-inch DRAM production capacity this year, outpacing South Korean makers as having the region’s largest DRAM production capacity.

Asia-Pacific chipmakers will account for 45% of the planned US$46 billion capex spent by chipmakers globally in 2005. About 20% of the capex spent in the Asia-Pacific region will be spent by Taiwan chipmakers, Burns added

By: DocMemory
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