With leading memory device solution maker SanDisk expecting its shipments will grow 2.5 fold next year, the company has decided to secure additional NAND flash backend capacity, with the company adding two firms to its partner list, according to industry sources

Advanced Semiconductor Engineering (ASE) and Lingsen Precision Industries (LPI) are the new partners for SanDisk, the sources noted. However, the two testing and packaging companies declined to comment on the news.

According to the sources, SanDisk will use ASE, as well as current partner Siliconware Precision Industries Ltd (SPIL), for high-end stacked packaging and chip scale packaging (CSP).

LPI will provide mid-range TSOP (thin small outline packaging).

For the testing segment, United Test and Assembly Center (UTAC) Taiwan will continue as the major testing house for SanDisk, providing turnkey testing services, as well as TSOP packaging.

Due to the current industry-wide testing and packaging capacity shortage, observers commented that SanDisk is making a wise move to secure backend production capacity for next year, as the memory device maker can minimize its risk of a production bottleneck, which is a problem most industry players are currently experiencing.

By: DocMemory
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