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AMD extended contract on SOI process


Tuesday, January 17, 2006 Silicon-on-insulator wafer supplier Soitec SA has signed an SOI wafer supply contract with Advanced Micro Devices Inc. worth more than $150 million for the 2006 calendar year.

This triples the similar deal that Soitec (Bernin, France) signed for 2005 which was considered to be worth $50 million when it was announced Jan. 17, 2005.

Under the terms of the deal Soitec is set to supply AMD with both 200-mm and 300-mm diameter SOI wafers, manufactured using the Smart Cut process. Soitec has been supplying AMD with volume quantities of thin-film Unibond SOI wafers for the production of microprocessors, since at least 2001.

By: DocMemory
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