Memory company Micron Technology said it had launched a range multichip package (MCP) memories for use in mobile phones and would be manufacturing them in volume late in 2006. These components comprise Micron DRAM optimized for low power consumption and NAND flash memory.

Micron (Boise, Idaho) is combining NAND flash memory and Mobile DRAM die in the same package The Multichip package (MCP) memories are sampling to customers and are expected to be available in a 1-Gbit NAND plus 512-Mbit DRAM configuration for volume production in Q4 2006.

Samsung Electronics Co. Ltd., which also makes both DRAM and NAND flash has been a leading developer of the MCP and has helped it develop into a market worth several billions of dollars per year.

“To meet the market's increasing demand for high density, small form factor, and low power devices, it's a natural evolution for Micron to further support the industry by creating a powerful NAND and DRAM packaging combination,” said Achim Hill, senior director of marketing for Micron's Mobile Memory Group, in a statement.

“MCP's will continue to expand beyond wireless handsets into emerging mobile multimedia devices, further driving the need for reliable, cost-effective solutions," added Hill, in the same statement.

By: DocMemory
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