Winbond Electronics today held an opening ceremony for a 12-inch wafer fab at the Central Taiwan Science Park (CTSP). The new fab consists of two wafer fabrication facilities, Fabs A and B, with mass production already underway at Fab A, which has a monthly capacity of 8,000 wafers.

Capacity at Fab A is expected to ramp up to 24,000 wafers by 2006, and Fab B is also designed to provide the same capacity. Fab B will begin operation after Fab A reaches its maximum capacity. The company expects the twin fabs will eventually house a combined capacity of 48,000 wafers per month.

In addition to this new 12-inch fab, Winbond also has one 6-inch fab and two 8-inch fabs in Taiwan. The 6-inch fab mainly produces wafers for logic products such as consumer ICs, PC and peripheral product ICs and network-access related ICs, with manufacturing capacity at around 50,000 wafers per month.

The two 8-inch fabs mainly produce memory products, including specialty DRAM, pseudo SRAM and flash memory, with a total monthly capacity of about 40,000 wafers.

By: DocMemory
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