TSMC reported that it has ready to go full production on its 65nm low-power process technology.

With several products already ramped and delivering production volumes, the 65nm low-power process provides higher levels of integration and performance improvement with power management technology for the lowest possible power usage.

“At 65nm geometries, we can produce highly integrated, very small and low power devices for every conceivable market,” Dr. Rick Tsai, president and CEO of TSMC, said in a statement. “Producing on our advanced 300mm wafers, we can ramp customers’ designs to high volume quickly. It provides unprecedented opportunities for customers to further advance the leadership positions in their marketplaces.”

By: DocMemory
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