Tuesday, June 20, 2006
NEC Electronics’ 90nm CMOS-compatible embedded DRAM (eDRAM) technology will be used in Nintendo Co. Ltd.’s Wii video game console.
The new system LSI chips with eDRAM will be manufactured using advanced technologies on NEC Yamagata's 300mm production lines, the Japanese giant said today.
As NEC explained, embedded DRAM technology integrates DRAM on the same chip with logic circuits, and is viewed as an optimal solution for 3D graphics acceleration systems and other applications that need to process high bandwidth data using low power. NEC’s fully CMOS-compatible eDRAM technology integrates a metal-insulator-metal 2 (MIM2) stacked DRAM capacitor on the company's standard CMOS process.
NEC selected MoSys as the DRAM macro design partner for the Wii devices, saying the company is experienced in implementing 1T-SRAM macros on the NEC eDRAM process and noting that MoSys designed the circuits and layout of high-speed 1T-SRAM macros on NEC’s 90nm CMOS-compatible eDRAM technology.
NEC did not disclose further details of the agreement.
In May, Nintendo announced that STMicroelectronics and Analog Devices Inc. would also play in its Wii, both providing micro electro-mechanical systems (MEMS) technology to the system’s controllers.
By: DocMemory
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