Xilinx Inc. has issued a recall of Spartan-3, Spartan-3E and Spartan-3L FPGAs made between early September 2005 and late April of this year.

In a statement on the company's Web site, Xilinx said that specific lots of wire-bonded plastic bond grid array (PBGA) packages have a manufacturing package defect that "presents a potential quality and reliability risk.” The recall pertains specifically to parts marked with date codes between 0537 and 0617.

Xilinx did not further elaborate on the specific details of the defect, noting that one customer had reported bond lift failures exhibited in the wire-bonded packages as of June 26.

The alert said that Xilinx has initiated reliability studies to determine the impact to the lifetime of the affected materials. The failure rate ranges from 1 percent to 5 percent in the single customer experience reported, the company said.

Xilinx recommends that all unassembled parts found to be affected be returned to the company for replacement.

By: DocMemory
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