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AMD to complete expansion of packaging capacity at Suzhou plant by 2008


Thursday, August 24, 2006

Advanced Micro Devices has set a goal of completing a capacity expansion at the company's CPU packaging and testing facility in Suzhou, Jiangsu Province (China), by 2008, according to Vanoy Wong, the VP of AMD Greater China Sales. A number of factory buildings will be added to the Suzhou plant, said Wong, who didn't reveal any further details of the capacity-expansion plan.

AMD's packaging plant in Suzhou commenced volume production in April 2005, said Wang, adding that the plant undertakes approximately a third of AMD's total packaging capacity, worldwide, at present. AMD has aggressively expanded operations in China, in an attempt to bring its services closer to local customers, with the formation of a Greater China headquarters in Beijing in September 2004 and a recently-announced R&D center in Shanghai, according to Wang.

Led by Karen Guo, president of AMD Greater China, AMD has progressively developed its presence in the China market, according to Wong. In addition to Hewlett-Packard (HP) and Lenovo, which have adopted AMD processors in a major way, the chip vendor has also retained close ties with the China-based Tsinghua Tongfang, Tsinghua Unisplendour and Huawei Technologies, said Wong. Dell's adoption of AMD processors will further enhance the chip vendor's market presence worldwide, Wong noted.

In addition, AMD began implementing its "50X15 Initiative," a commitment to empower 50% of the world's population with basic Internet access by the year 2015, in China in 2005, by licensing its x86 processor design to the Chinese government, Wong indicated. The promotion of low-cost PCs in emerging markets is also considered a key to AMD's continuing ability to increase its sales and grow its market share, worldwide, Wong said.

By: DocMemory
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