Tuesday, August 29, 2006
Qimonda AG, the DRAM spin-off of Germany's Infineon Technologies AG, and Taiwanese foundry Winbond, have extended their their DRAM manufacturing partnership.
The new agreement calls for Qimonda to transfer its 80-nm DRAM trench technology to Winbonds 300-mm facility in Taichung. In return, Winbond will manufacture DRAMs for computing applications in this technology exclusively for Qimonda.
The groups say the expansion of the process technology transfer to 80-nm is an important step to maintain close collaboration between the two companies in the future.
In May 2002 and August 2004, the two signed agreements on the transfer and licensing of 110-nm and 90-nm DRAM-technologies for Winbonds 200-mm plant in Hsinchu and 300-mm plant in Taichung.
The German memory maker has access to five major manufacturing sites on three continents. Besides Richmond, Virginia in the U.S., Quimonda owns a site in Dresden, Germany and operates another site in Taiwan as part of a joint venture with Inotera. And in addition to the foundry agreement with Winbond, it employs SMIC in China for making some parts.
"The extension of our cooperation with Winbond underlines our partnership commitment in Asia and it further increases our production capabilities and flexibility," said Kin Wah Loh, CEO of Qimonda.
By: DocMemory
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