DRAM makers using either trench or stack technology seem to be facing a bottleneck on their migration to 70nm from 90nm processes, and are putting out 80nm products as a transitional process in the meantime, according to industry sources.

Already running production at the 90nm level, all major DRAM makers are stepping up development of 70nm processes in order to further cut manufacturing costs and to migrate to DDR3, the sources indicated.

However, some players from the trench technology camp recently pointed out that they may produce at the 80nm node before entering the 70nm process, although they insisted that the timetable for their adopting 70nm processes remains unchanged.

The sources commented that adoption by trench DRAM makers of the 80nm process may be an indication of a technological barrier in migrating to 70nm.

Some players using stack technology reportedly also have plans to adopt 80nm processes as a transition to the 70nm, the sources revealed, claiming some stack DRAM makers might delay their migration to the 70nm processes.

By: DocMemory
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