Qimonda and Nanya Technology have jointly announced the successful qualification of their 75nm DRAM Trench technology.

This next-generation technology platform features minimum structure sizes down to 70nm. The technology and 512Mb DDR2 product have been jointly developed at Qimonda's development centers in Dresden and Munich, Germany.

The 512Mb DDR2 product in the 75nm technology that has now been qualified meets the performance requirements at the maximum JEDEC defined DDR2 speed for high end server and computing applications and demonstrates the capability of Qimonda's 75nm technology to be used in future high speed DRAM products. The introduction of 75nm technology is not only important for next-generation performance requirements but also a further step to improve Qimonda's and Nanya's cost positions. Process structures of 75nm further reduce chip size compared to the 90nm technology, thereby increasing potential chip output per 300mm wafer by about 40%.

Volume production in the new DRAM technology generation has been started at Qimonda's 300mm production line in Dresden.

By: DocMemrory
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