Livermore, Calif.-based semiconductor test wafer probe card supplier FormFactor Inc. reported Monday it has filed a patent infringement lawsuit against Micronics Japan Co. Ltd., alleging infringement of four U.S. patents.

The lawsuit was filed in federal district court in California and alleges that Micronics is infringing on patents that cover key aspects of FormFactor's wafer probe cards.

The U.S. patents asserted in the filing against Micronics and its subsidiary are U.S. Patent No. 6,246,247 for “Probe Card Assembly And Kit, And Methods Of Using Same,” U.S. Patent No. 6,509,751 for “Planarizer For A Semiconductor Contactor,” U.S. Patent No. 6,624,648 for “Probe Card Assembly,” and U.S. Patent No. 7,073,254 for “Method For Mounting A Plurality Of Spring Contact Elements.”

Igor Khandros, CEO of FormFactor said in a statement that the company is, “committed to delivering mission critical products to its customers and to lowering their overall cost of test. Our commitment is fueled by innovation and the resulting intellectual property rights provide the foundation for our continuing progress.”

“We can not condone unauthorized third parties using our proprietary technology and this latest infringement action is a necessary step to protect our investment in research and development,” he added.

The filing of this complaint follows actions initiated by FormFactor in 2004 against Phicom in the Seoul Southern District Court in Korea, and in U.S. federal court in Oregon in 2005.

All of these cases are still pending.

By: DocMemory
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