Tuesday, November 28, 2006
A Hua Hong NEC affiliate has opted to build a 200-mm wafer line in Shanghai instead of a previously planned 300-mm wafer fab, accordingly to the company.
Few details were given regarding the change. A spokeswoman would only acknowledge that the 200-mm line will add to the foundry capacity of Hua Hong NEC and that the parent company, Hua Hong Group, will not immediately pursue a goal of becoming an IDM.
Rumors have circulated in China for the past few months that Hua Hong was delaying orders for 300-mm wafer equipment. Originally, the company planned to set up a pilot line running 3,000 to 5,000 wafers per month by year's end. The 300-mm wafer fab was part of a larger vision of transforming Hua Hong Group into an international caliber IDM, a task that had been given to Hua Hong chief executive David Wang, a former Applied Materials executive.
By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved
|
