Wednesday, December 20, 2006
AMD has entered into an agreement to license Amkor Technology Inc.'s lead free (Pb-free) electroplated wafer bumping technology.
The electronics industry is striving to reduce or eliminate certain elements and compounds, such as lead, mercury, cadmium and halogen, in favor of "Green" products in response to legislation in Europe and Japan.
Wafer bumping is the process of depositing tiny solder "bumps" onto fabricated semiconductor wafers and is a key step in creating flip chip-based IC packages. The growing adoption of flip chip packaging, coupled with the "Green" electronics movement, means that semiconductor manufacturers will increasingly turn to Pb-free wafer bumping technology.
"AMD's decision to license our Unitive lead free bumping technology is an indication of Amkor's technological leadership in advanced packaging applications," said Oleg Khaykin, executive vice president and COO of Amkor, in a statement. "We are currently in discussion with other companies to foster broader industry adoption and support of our advanced wafer-level packaging technology."
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