The board of directors of Winbond Electronics on December 29 approved a plan to spend about US$21.6 million to acquire approximately 54,375 square feet of commercial land close to the Hsinchu station of Taiwan's High-Speed Rail line, with the company planning to spend another NT$700 million to build its own R&D building on the site, according to the company.

The R&D building of the IC design house, which will have enough space for 1000 employees, will be located only a five minute walk from the High-Speed Rail station located in Chupei City near Hsinchu. In the future, the company's employees can ride the High-Speed Rail to work, shortening commute time and thereby improving work and living quality, according to Winbond.

By: DocMemory
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