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UMC set to open new 300mm fab R&D site


Monday, January 8, 2007

 

United Microelectronics Corp (UMC) said it is ontrack the plans and foresees opening a new $5 billion 300mm founary wafer plant in 2008.

The plant, located near the southern Taiwan city of Tainan, will have a capacity of 45,000 wafers per month. It will be UMC's third 300mm facility — UMC other plants are located in Tainan and Singapore .

In March, the foundry also expects to complete construction of an R&D center in Tainan to research advanced nanometer manufacturing, the company said.

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