Friday, January 26, 2007
Joint venture partners Elpida Memory Inc. and Powerchip Semiconductor Corp. aim to launch manufacturing operations with a 70-nm process by this summer.
"We named the joint venture Rexchip, which symbolizes our ambition to become the king of the DRAM arena," said Yukio Sakamoto, president and CEO of Elpida.
Located in Houli, Taiwn, the joint venture Rexchip Electronics Corp. is evenly owned by Elpida and PSC. Output will also be evenly divided between the partners.
Elpida expects that its total monthly capacity including Rexchip will reach 240,000 300-mm wafers by 2008. "If the capacity expands to this level, we can aim for the top position or the second in the market," said Sakamoto.
Elpida will expand its 300-mm wafer fabrication capacity from 120,000 wafers a month to 170,000 wafers a month by December. Sakamoto estimated that about 60 percent of its DRAMs are fabricated with 300-mm wafers. Elpida and PSC are aiming for the largest 300-mm wafer capacity in the industry, he said.
By: DocMemory
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