Elpida Memory has announced that it has signed a final agreement with Powerchip Semiconductor Corporation. (PSC) to begin operations of their new DRAM joint-venture at the Central Taiwan Science Park (CTSP) in April of 2007.

The official name of the joint-venture will be Rexchip Electronics. Current senior vice president, Stephen CK Chen, will act as president. Capital size of the Rexchip is set at NT$2 million (US$60,000) with an initial investment amount of NT$40-50 billion. PSC and Elpida will split the initial investment amount evenly, according to PSC.

Operation is slated to start in April, 2007 with a planned monthly capacity of 30,000 12-inch wafers. According to Elpida, equipment installation will start in the second quarter of 2007, mass production to follow in the third quarter and shipments will start during late 2007.

According to PSC, R1(formerly Fab 12C) will directly introduce 70nm on 1Gb DRAM production. Same design rules will also apply to 1GB NAND flash production at the site.

During a previous investor conference, PSC said it might build at least two more fabs on its own, in addition to this joint-venture. PSC is currently running around 110,000 12-inch wafer starts per month. R1 is expected to ramp up to a full capacity of 60,000 wafer starts per month by 2008.

By: DocMemory
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